In many cases the development of new components and products is only possible with the help of modern processing using ultrashort pulse lasers. To manufacture precision parts in areas like medical technology, electrical engineering, automotive engineering, precision mechanics or toolmaking it is essential to be able to produce high-precision, fine, but also flexible structures, cuts or holes while maintaining high quality on the machined edges and surfaces and ensuring minimal damage to the material of the workpiece.
In the production of medical products such as pacemakers, fine pumps and dosing equipment, implants, diagnostic imaging devices or components for orthopedic surgery, high precision and reliability are essential.
Ultrashort pulse laser technology is making it possible to develop groundbreaking methods of processing in the field of electrical engineering. Material-independent processing of sensitive materials on a very minute scale opens up enormous new vistas of potential.
Micro components and structures are important elements in the production of automobiles. In many cases manufacturers and suppliers of precision components and tools make use of the capabilities of picosecond and femtosecond lasers.
The combination of the high reproducibility of USP laser processes and the ability to process any hard material offers a wealth of ways for structuring extrusion, EDM, pressure or embossing tools.
In precision mechanics the ultrashort pulse laser adds new possibilities to classic machining processes. The special benefits it offers include burr-free component edges, the highest precision in the range of a thousandth of a millimeter, and material independence.
Originally developed for use as light source for fast chemical processes, ultrashort pulse lasers first achieved a breakthrough in material processing in the mid-90s. Since then they have played an important role in industrial science and research.
Sealing materials are important components of pressure and vacuum technology. Under high pressures or in pressurized and vacuum processes with high temperatures the demands on the properties of the sealing materials increase too. The special benefit offered by USP laser processing: sealing materials, such as polytetrafluorethylene (PTFE) or polyimide (PI), can be cut flexibly and without inflicting damage.
The term microengineering covers all the different techniques for manufacturing and processing components and structures with small dimensions. In the development and manufacturing of sensors, actuators or microoptics, USP lasers serve to expand the traditional techniques, and in some cases facilitate completely new possibilities through contact and damage-free methods of processing.